Samsung’s upcoming flagship smartphone is anticipated to arrive in May, and to sport an ultra-thin frame that measures just 7mm in thickness.
Thought to be slimmer than the current Galaxy S II model, the S III is expected to feature an incredible 7mm-thick frame – that should certainly enable Samsung to reclaim the “world’s thinnest smartphone” title that the S2 lost out to the iPhone 4 last year, despite having an 8.49mm frame and the iPhone a 9.3mm design. The ASA ruled that because the Galaxy S2 measures 9.91mm in thickness in places, the Apple gadget was crowned the winner.
So size does matter in the battle of the smartphones, and, after all, the iPhone 5 is destined to be one of the S3 biggest rivals. The next-generation iPhone is rumoured to have a June release date, and it had previously been speculated that the Galaxy S II successor would arrive by June this year also.
Now we have word, via Oled-Display.net, that the 7mm-thick Galaxy S3 is scheduled for a May launch.
But what we want to know is, how has Samsung managed to slim down the already-slim S II handset? Apparently, the extra slenderness comes from the fact the printed circuit board (PCB), connector ports and processor chips can all be made with 10% to 20% less bulk than standard parts.
In addition to the skinny design, you can expect high-end specs onboard the new Samsung Galaxy premium phone. These are said to include a quad-core processor, Ice Cream Sandwich software, HD Super AMOLED display, and a camera that supports 3D.
Details are unconfirmed at this stage, but it’s looking more and more likely that Samsung will unveil its S II successor very soon – with a May/June release date anticipated. The S3 won’t be on show at MWC, so we’ll have to be patient a while longer before Samsung announces its special event for the upcoming device.
Have you got your eye on the Galaxy S3?
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